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The small size plastic packages can be
designed to meet the functional
requirements. |
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the full molding base joined
the leadframe within |
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The injection molding of the
special thermoset epoxy resin.Then, |
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high productivity |
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high heat resistance for the reflow
soldering system |
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The special epoxy resin has excellent
adherent property to the leadframe. |
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Base Resin: Epoxy Resin
Bending Strength: 18kg/mm2
Heat Resistance
(ASTM D 648, 18.6kg/mm2): >250。C
Coefficient of Thermal Expansion
(ASTM D 696): 1.6 ×10–5/。C
Thermal Conductivity (probe method):
16×10–4cal/cm sec。C
Electric Resistance
( 21。C): >1015Ω・cm
(150。C): 1013Ω・cm
Leadframe: Cu
(Heat resistant Cu Alloy, Cu>99.60%)
Electric Resistance: 2.54μΩ・cm(20。C)
Plating: Ni 1μm ＋ Au 0.1μm (standard) |
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